Market ScopeMarket Research Future (MRFR), in its report on the global 3D semiconductor packaging market, reveals that the market is expected is likely to register a CAGR of 16.25% across the evaluation period of 2018 to 2023 and touch a valuation of USD 37,400 million by the end of the forecast period.
Segmental Outline
The worldwide 3D semiconductor packaging market has been segmented by type, method of packaging, and end-user. By type, the market has been segmented into 3D SIP, 3D SIC, 3D WLP, and 3D IC. In 2017, 33.5% of the total market share was held by the 3D SIP segment. It is expected that by 2023, the segment is likely to thrive at a 15.0%. CAGR. The use of 3D SIP in the manufacturing of premium-grade products is noted to surge. By packaging method, the market has been segmented into Through Silicon via (TSV), Through Class Via (TGV), Package on Package, and others. In 2017, the silicon via (TSV) segment was valued at USD 6,372.0 million. The high density and the short connection feature of TSV enabling them to gain popularity among people. The significant contribution of TSV is expected to boost the global 3D semiconductor packaging market. By end use, [FURL=https://www.marketresearchfuture.com/reports/3d-semiconductor-packaging-market-7748]3D Semiconductor Packaging Industry[/FURL] has been segmented into Telecommunication, Consumer Electronics, Industrial, Military and Aerospace, Automotive, and others. The consumer electronics segment is anticipated to expand at a CAGR of 15.99% across the review period and can exceed a valuation of USD 11,700 million by 2023. High sales volume of consumer electronics is expected to benefit the market.
Key Players
Some of the top-notch companies that are operating in the global 3D semiconductor packaging market are asm AG, Taiwan Semiconductor Manufacturing Co. Ltd, Amkor Technology Inc, Jiangsu Changjiang Electronics Technology Co., Ltd., Intel Corporation, Samsung Electronics Corporation Ltd., STMicroelectronics NV, Advanced Semiconductor Engineering Inc., Xilinx Inc., Siliconware Precision Induatries Co., Ltd., and Taiwan Semiconductor Manufacturing Co. Ltd.
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