Market Research Future (MRFR), asserts in its recently published research report, that the global power supply in packaging and power supply on chip market might reach approximately USD 2,300 Mn by 2023, at a significant CAGR throughout the review period.

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Competitive Analysis

The major market players operating in the global market as identified by MRFR are Intel Corporation, ASE Group, TDK Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd., Amkor Technology, Vicor Corporation, Panasonic Corporation, Texas Instruments Incorporated, ON Semiconductor, and Bel Fuse Inc.

The global market for power supply in package (PSiP) and power supply on chip (PwrSoC) is very competitive due to the presence of suppliers, manufacturers, and third-party vendors in a higher concentration.These companies account for a reasonably higher revenue generation and hold superior market positions. The major market players operating in the power supply in packaging and Power Supply on Chip (PwrSoC) market are focusing on increasing product portfolio and product innovation.

Regional Analysis

The geographical analysis of PSiP and PwrSoC Market has been conducted in four major regions, including the Asia Pacific, North America, Europe, and the rest of the world (LAtin America, the Middle East and Africa) The market in APAC is expected to remain highly attractive during the forecast period. In 2017, the asia pacific registered a 48.3% share of the market and projected to witness 26.9% CAGR during the review period. The manufacturing sector in the APAC region has undergone massive development in recent years, which is likely to have a positive impact on the market in the region. China’s rise as a global industrial hub has drawn noteworthy investment in the countries.

North America and Europe are the two other important markets for PSiP and PwrSoC. over the review period, the market in North America is slated to witness a relatively higher CAGR, meanwhile Europe will uphold its position as the third largest PSiP and PwrSoC market over the review period.

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